1855 & 1856, Jalan Kolej, 43300 Seri Kembangan, Selangor, Malaysia.
Main Office
1855 & 1856, Jalan Kolej, 43300 Seri Kembangan, Selangor, Malaysia.
Main Office
Features:
1. Design for RF chip inductor use.
2. High dimensional accuracy.
3. Flat termination & L – shape termination are available.
4. Do not contain lead & support lead‐free soldering.
5. Provide Au terminal for high temperature bonding process.
Features:
1. Design for RF,EMI,Converter application chip inductor use.
2. High dimensional accuracy.
3. Flat termination & L – shape termination are available.
4. Do not contain lead & support lead‐free soldering.
5. Provide Au terminal for high temperature bonding process.
Features:
1. Design for common mode choke filter use.
2. Do not contain lead & support lead‐free soldering.
3. Provide Au termination for high temperature bonding process.
Features:
1. Design for SMD power inductor use.
2. Low profile, high strength.
3. Do not contain lead & support lead‐free soldering.
4. Provide Ag‐Ni‐Sn termination for automatic bonding process.
Features:
1. Targeted for applications demanding high stability such as motion analysis and control, navigation system, steering control and tyre pressure transponder.
2. Available for gold / tin plated termination.
3. Do not contain lead & support lead‐free soldering.
4. Provide Au termination for high temperature bonding process.