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A&I M Manufacturing (M) Sdn. Bhd.

1855 & 1856, Jalan Kolej, 43300 Seri Kembangan, Selangor, Malaysia.

Leave message to us

* Please Fill Required Fields *

Fax:

+603 - 8948 5888

E-mail Address:

info@aimtl.com

Business Hours:

Main Office

  • Monday - Friday8am - 6pm
  • Saturday, Sunday &
    Public Holidays
    Closed
  • svg
  • svg
  • svg
  • svg
thumb

A&I M Manufacturing (M) Sdn. Bhd.

1855 & 1856, Jalan Kolej, 43300 Seri Kembangan, Selangor, Malaysia.

Leave message to us

* Please Fill Required Fields *

Fax:

+603 - 8948 5888

E-mail Address:

info@aimtl.com

Business Hours:

Main Office

  • Monday - Friday8am - 6pm
  • Saturday, Sunday &
    Public Holidays
    Closed

Products

Produce ceramic and ferrite core for the application as below:

  • 1. High frequency high Q RF chip inductor.
  • 2. Common mode filter.
  • 3. Low profile SMD power inductor.
  • * All products can be customised according to customer's requirements.
  • Ceramic Core For Chip Inductor

    Features:

    1. Design for RF chip inductor use.
    2. High dimensional accuracy.
    3. Flat termination & L – shape termination are available.
    4. Do not contain lead & support lead‐free soldering.
    5. Provide Au terminal for high temperature bonding process.

  • Ferrite Core For Chip Inductor

    Features:

    1. Design for RF,EMI,Converter application chip inductor use.
    2. High dimensional accuracy.
    3. Flat termination & L – shape termination are available.
    4. Do not contain lead & support lead‐free soldering.
    5. Provide Au terminal for high temperature bonding process.

  • Ferrite Core For CMC Filter

    Features:

    1. Design for common mode choke filter use.
    2. Do not contain lead & support lead‐free soldering.
    3. Provide Au termination for high temperature bonding process.

  • Ferrite Core For Power Inductor

    Features:

    1. Design for SMD power inductor use.
    2. Low profile, high strength.
    3. Do not contain lead & support lead‐free soldering.
    4. Provide Ag‐Ni‐Sn termination for automatic bonding process.

  • Transponder

    Features:

    1. Targeted for applications demanding high stability such as motion analysis and control, navigation system, steering control and tyre pressure transponder.
    2. Available for gold / tin plated termination.
    3. Do not contain lead & support lead‐free soldering.
    4. Provide Au termination for high temperature bonding process.