1. Design for RF,EMI,Converter application chip inductor use.
2. High dimensional accuracy.
3. Flat termination & L – shape termination are available.
4. Do not contain lead & support lead‐free soldering.
5. Provide Au terminal for high temperature bonding process.
1. Targeted for applications demanding high stability such as motion analysis and control, navigation system, steering control and tyre pressure transponder.
2. Available for gold / tin plated termination.
3. Do not contain lead & support lead‐free soldering.
4. Provide Au termination for high temperature bonding process.